The Intel 9th Gen Review: Core i9-9900K, Core i7-9700K and Core i5-9600K Tested
by Ian Cutress on October 19, 2018 9:00 AM EST- Posted in
- CPUs
- Intel
- Coffee Lake
- 14++
- Core 9th Gen
- Core-S
- i9-9900K
- i7-9700K
- i5-9600K
Hardware and Software Security Fixes
The Spectre and Meltdown vulnerabilities made quite a splash earlier this year, forcing makers of hardware and software to release updates in order to tackle them. There are several ways to fix the issues, including software, firmware, and hardware updates. Each generation of product is slowly implementing fixes, including some of the new 9th Generation processors.
At this point Intel has split the list down into 5/6 wide variants of different types of vulnerabilities. For all processors beyond mid-2018, here is what the fix table looks like:
Spectre and Meltdown on Intel | |||||||
AnandTech | SKX-R 3175X |
CFL-R | Cascade Lake | Whiskey Lake |
Amber Lake |
||
Spectre | Variant 1 | Bounds Check Bypass | OS/VMM | OS/VMM | OS/VMM | OS/VMM | OS/VMM |
Spectre | Variant 2 | Branch Target Injection | Firmware + OS | Firmware + OS | Hardware + OS | Firmware + OS | Firmware + OS |
Meltdown | Variant 3 | Rogue Data Cache Load | Firmware | Hardware | Hardware | Hardware | Firmware |
Meltdown | Variant 3a | Rogue System Register Read | Firmware | Firmware | Firmware | Firmware | Firmware |
Variant 4 | Speculative Store Bypass | Firmware + OS | Firmware + OS | Firmware + OS | Firmware + OS | Firmware + OS | |
Variant 5 | L1 Terminal Fault | Firmware | Hardware | Hardware | Hardware | Firmware |
The new 9th Generation processors, listed as CFL-R (Coffee Lake Refresh), has implemented hardware fixes for variant 3, Rogue Data Cache Load, and variant 5, L1 Terminal Fault.
Because the new chips have required new masks for manufacturing, Intel has been able to make these changes. The goal of moving the changes into hardware means that the hardware is always protected, regardless of OS or environment, and with the hope that any additional overhead created by a software fix can be lessened if done in hardware.
(S)TIM: Soldered Down Processors
With the desktop processors we use today, they are built from a silicon die (the smart bit), a package substrate (the green bit), a heatspreader (the silver bit), and a material that helps transfer heat from the silicon die to the heatspreader. The quality of the binding between the silicon die and the heatspreader using this thermal interface material is a key component in the processors ability to remove the heat generated from using it.
Traditionally there are two different types of thermal material: a heat conductive paste, or a bonded metal. Both have positives and negatives.
The heat conductive paste is a universal tool – it can be applied to practically any manufactured processor, and is able to deal with a wide range of changing conditions. Because metals expand under temperature, when a processor is used and gets hot, it expands – so does the heatspreader. The paste can easily deal with this. This allows paste-based processors to live longer and in more environments. Using a bonded metal typically reduces the level of thermal cycling possible, as the metal also expands and contracts in a non-fluid way. This might mean the processors has a rated lifespan of several years, rather than a dozen years. However, the bonded metal solution performs a lot, lot better – metal conducts heat better than the silicon-based pastes – but it is slightly more expensive (a dollar or two per unit, at most, when the materials and manufacturing are taken into account).
Thermal Interface | |||||||
Intel | Celeron | Pentium | Core i3 | Core i5 | Core i7 Core i9 |
HEDT | |
Sandy Bridge | LGA1155 | Paste | Paste | Paste | Bonded | Bonded | Bonded |
Ivy Bridge | LGA1155 | Paste | Paste | Paste | Paste | Paste | Bonded |
Haswell / DK | LGA1150 | Paste | Paste | Paste | Paste | Paste | Bonded |
Broadwell | LGA1150 | Paste | Paste | Paste | Paste | Paste | Bonded |
Skylake | LGA1151 | Paste | Paste | Paste | Paste | Paste | Paste |
Kaby Lake | LGA1151 | Paste | Paste | Paste | Paste | Paste | - |
Coffee Lake | 1151 v2 | Paste | Paste | Paste | Paste | Paste | - |
CFL-R | 1151 v2 | ? | ? | ? | K = Bonded | - | |
AMD | |||||||
Zambezi | AM3+ | Bonded | Carrizo | AM4 | Bonded | ||
Vishera | AM3+ | Bonded | Bristol R | AM4 | Bonded | ||
Llano | FM1 | Paste | Summit R | AM4 | Bonded | ||
Trinity | FM2 | Paste | Raven R | AM4 | Paste | ||
Richland | FM2 | Paste | Pinnacle | AM4 | Bonded | ||
Kaveri | FM2+ | Paste / Bonded* | TR | TR4 | Bonded | ||
Carrizo | FM2+ | Paste | TR2 | TR4 | Bonded | ||
Kabini | AM1 | Paste | |||||
*Some Kaveri Refresh were bonded |
In our Ryzen APU delidding article, we went through the process of removing the heatspreader and conductive paste from a popular low cost product, and we showed that replacing that paste with a bonded liquid metal improved temperatures, overclocking, and performance in mid-range overclocks. If any company wants to make enthusiasts happy, using a bonded metal is the way to go.
For several years, Intel has always stated that they are there for enthusiasts. In the distant past, as the table above shows, Intel provided processors with a soldered bonded metal interface and was happy to do so. In recent times however, the whole product line was pushed into the heat conductive paste for a number of reasons.
As Intel was continually saying that they still cared about enthusiasts, a number of users were concerned that Intel was getting itself confused. Some believed that Intel had ‘enthusiasts’ and ‘overclockers’ in two distinct non-overlapping categories. It is what it is, but now Intel has returned to using applying STIM and wants to court overclockers again.
Intel has officially confirmed that new 9th generation processors will feature a layer of solder making up the TIM between the die and the IHS. The new processors with solder include the Core i9-9900K, the Core i7-9700K and Core i5-9600K.
As we’ll show in this review, the combination of STIM plus other features are of great assistance when pushing the new processors to the overclocking limits. Intel’s own overclocking team at the launch event hit 6.9 GHz temporarily using exotic sub-zero coolants such as liquid nitrogen.
Motherboards and the Z390 Chipset
One of the worst kept secrets this year has been Intel’s Z390 chipset. If you believe everything the motherboard manufacturers have told me, most of them had been ready for this release for several months, hence why seeing around 55 new motherboards hit the market this month and into next.
The Z390 chipset is an update to Z370, and both types of motherboards will support 8000-series and 9000-series processors (Z370 will need a BIOS update). The updates are similar to the updates seen with B360: native USB 3.1 10 Gbps ports, and integrated Wi-Fi on the chipset.
Intel Z390, Z370 and Z270 Chipset Comparison | |||
Feature | Z390 | Z370 | Z270 |
Max PCH PCIe 3.0 Lanes | 24 | 24 | 24 |
Max USB 3.1 (Gen2/Gen1) | 6/10 | 0/10 | 0/10 |
Total USB | 14 | 14 | 14 |
Max SATA Ports | 6 | 6 | 6 |
PCIe Config | x16 x8/x8 x8/x4/x4 |
x16 x8/x8 x8/x4/x4 |
x16 x8/x8 x8/x4/x4 |
Memory Channels | 2 | 2 | 2 |
Intel Optane Memory Support | Y | Y | Y |
Intel Rapid Storage Technology (RST) | Y | Y | Y |
Max Rapid Storage Technology Ports | 3 | 3 | 3 |
Integrated 802.11ac WiFi MAC | Y | N | N |
Intel Smart Sound | Y | Y | Y |
Integrated SDXC (SDA 3.0) Support | Y | N | N |
DMI | 3.0 | 3.0 | 3.0 |
Overclocking Support | Y | Y | Y |
Intel vPro | N | N | N |
Max HSIO Lanes | 30 | 30 | 30 |
Intel Smart Sound | Y | Y | Y |
ME Firmware | 12 | 11 | 11 |
The integrated Wi-Fi uses CNVi, which allows the motherboard manufacturer to use one of Intel’s three companion RF modules as a PHY, rather than using a potentially more expensive MAC+PHY combo from a different vendor (such as Broadcom). I have been told that the cost of implementing a CRF adds about $15 to the retail price of the board, so we are likely to see some vendors experiment with mid-price models with-and-without Wi-Fi using this method.
ASRock Z390 Phantom Gaming-ITX/ac
For the USB 3.1 Gen 2 ports, Type-A ports are supported natively and motherboard manufacturers will have to use re-driver chips to support Type-C reversibility. These come at extra cost, as one might expect. It will be interesting to see how manufacturers mix and match the Gen 2, Gen 1, and USB 2.0 ports on the rear panels, now they have a choice. I suspect it will come down to signal integrity on the traces on the motherboard.
For the Z390 chipset and motherboards, we have our usual every-board-overview post, covering every model the manufacturers would tell us about. Interestingly there is going to be a mini-ITX with Thunderbolt 3, and one board with a PLX chip! There are also some motherboards with Realtek’s 2.5G Ethernet controller – now if only we also had consumer grade switches.
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Ian Cutress - Monday, October 22, 2018 - link
Emn13: Base code with compiler optimizations only, such as those a non-CompSci scientist would use, as was the original intention of the 3DPM test, vs hand tuned AVX/AVX2/AVX512 code.just4U - Saturday, October 20, 2018 - link
The only problem I really have with the product is for the price it should have come with a nice fancy cooler like the 2700x which is in it's own right a stellar product at close to 60% of the cost. Not sure what intel's game plan is with this but It's priced close to a second gen entry threadripper and for it's cost you might as well just make the leap for a little more.khanikun - Monday, October 22, 2018 - link
I'm the other way. I'd much rather they lower the cost and have no cooler. Although, Intel doesn't decrease the cost without the cooler, which sucks.I'm either getting a new waterblock or drilling holes in the waterblock bracket to make it fit. Well I just upgraded, so I'm not in the market for any of these procs.
brunis.dk - Saturday, October 20, 2018 - link
no prayers for AMD?ingwe - Friday, October 19, 2018 - link
I don't see the value in it though I understand that this isn't sold as a value proposition--it is sold for performance. Seems to do the job it sets out to do but isn't spectacularly exciting to me.jospoortvliet - Saturday, October 20, 2018 - link
Given how the quoted prices ignore the fact that right now Intel CPU prices art 30-50% higher than MSRP, yes, nobody thinking about value for money buys these...DanNeely - Friday, October 19, 2018 - link
Seriously though, I'm wondering about the handful of benchmarks that showed the i7 beating the i9 by significant amounts. 1-2% I assume is sampling noise in cases where the two are tied, but flipping through the article I saw a few where the i7 won by significant margins.Ian Cutress - Friday, October 19, 2018 - link
Certain benchmarks seem to be core-resource bound. In HT mode, certain elements of the core are statically partitioned, giving each thread half, and if only one thread is there, you still only get half. With no HT, a thread gets the full core to work with.0ldman79 - Friday, October 19, 2018 - link
I'd love to see some low level data on the i5 vs i7 on that topic.If the i5 is only missing HT then the i7 without HT should score identically (more or less) with the i5 winning on occasion vs the HT enabled i7. I always figured there was a significant bit of idle resources (ALU pipelines) in the i5 vs the i7, HT allowed 100% (or as close as possible) usage of all of the pipelines.
I wish Intel would release detailed info on that.
abufrejoval - Friday, October 19, 2018 - link
Well I guess you should be able to measure, if you have the chips. My understanding has alway been, that i7/i5 differentiation is all about voltage levels with i5 parts needing too much voltage/power to pass the TDP restrictions rather than defective logic precluding the use of 'one hyperthread'. I find it hard to imagine managing defects via partitions in the register file or by disabling certain ALUs: If core CPU logic is hit with a defect it's dead, because you can't isolate and route around the defective part at that granularity. It's the voltage levels on the long wires that determine a CPUs fate AFAIK.It's a free choice between a lower clock and HT or the higher clock without HT at the binning point and Intel will determine the fate of a chips on sales opportunities rather than hardware. And it's somewhat similar with the fully enabled lower power -T parts and the high-frequency -K parts, which are most likely the same (or very similar) top tier bins, sold at two distinct voltage levels yet rather similar premium prices, because you trade power and clocks and pay premium for efficiency.
Real chips defects can only be 'compensated' via cutting off cache blocks or whole cores, but again I'd tend to think that even that will be more driven by voltage considerations than 'hairs in the soup': With all this multi-patterning and multi-masking going on and the 3D structures they are lovingly creating for every FinFeT their control over the basic structures is so great, that it's mainly the layer alignment/conductivity that's challenging the yields.